photo of Amber Epoxy Resin 2 Part Kit, Encapsulation Potting Compound, Hot, Cold Curing Resins, Large 500g

Amber Epoxy Resin 2 Part Kit Encapsulation Potting Compound Hot & Cold Curing

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Product Details

Amber Epoxy Resin 2 Part Kit, Encapsulation Potting Compound, Hot, Cold Curing Resins, Large 500g

A high quality two-part clear amber epoxy resin encapsulation and potting compound. This epoxy potting compound provides a tough coating around your electrical components offering good protection from chemicals and water as well as having good electrical properties. One of the main features of this epoxy potting compound is an ability to adhere to a wide range of materials. Once applied, a strong bond is formed which is maintained even in harsh conditions. When this epoxy compound cures it forms a tough resin, however, flexibility can be adjusted by decreasing the amount of hardener when mixed which should be carried out after careful testing. This clear amber epoxy compound can be used as both a potting compound and an adhesive making it both versatile and cost-effective.

What is Epoxy Resin Potting Compound?

This epoxy resin is a type of electronic potting compound used for the encapsulation of PCBs (Printed Circuit Boards) and electronics components. Potting is a process of filling a complete electronic assembly with a solid or gelatinous compound. The epoxy resin, once applied, cured and hardened encases your electronics in a solid mass providing a barrier. This barrier protects and insulates the components from damaging environments including water, chemicals, and general contamination allowing them to maintain a high performance.

Features and Benefits

• Tough epoxy resin system
• Excellent adhesion to a wide range of substrates
• Maintains good bond strength in harsh conditions
• Good electrical properties
• Can be hot or cold cured
• Versatile, can be used as an adhesive or encapsulant
• Mix ratio can be altered to adjust flexibility

What is this Epoxy Resin Potting Compound Used For?

This highly adhesive epoxy resin can be used as for both encapsulation and bonding applications. The strong adhesive properties of this epoxy resin makes it ideal for use in applications where strong mechanical forces are being applied to the unit or in cable jointing applications.

Whats in the Kit?

This epoxy potting compound is supplied in a kit consisting of two components; a can containing 250g of resin and a 250g can of hardener. Each kit is supplied with full instructions for use.

How do you Apply Potting Compound?

Before applying this epoxy potting compound it is important that any residue or contaminants are removed from the electronic components prior to potting. The electronic assembly is placed inside a mould called ’The pot’. This mould is then filled with the mixed potting compound that hardens and permanently protects the assembly. Circuit boards can also be potted and are often called ’potted’ PCBs. These circuit boards have high walled sides forming an enclosure with the mounted electronic components sitting inside. The potting compound is then poured into this enclosure.

Note

Properties quoted are for 1:1 mix ratio by weight. A measure of flexibility may be introduced to the compound without impairing its electrical properties by adding more hardener to the mix: this will also improve the adhesion and act as a vibration damper.

Potting Compounds

The Potting Compounds are pourable two-part compounds for potting and encapsulating electronic circuits and components. They protect against moisture and corrosion and improve insulation resistance and mechanical strength. They may be cured at room temperature, or oven cured. Use silicone oil aerosol as a mould release agent. Full instructions supplied with each pack. 


Specifications

Attribute

Value

Product Material

Epoxy

Package Type

Pack

Package Size

500 g

Cure Time

24 → 48 h

Hardness

80 Shore D

Colour

Amber

Maximum Operating Temperature

+120°C

Minimum Operating Temperature

-40°C

Chemical Composition

Epoxy Resin

Operating Temperature Range

-40 → +120 °C

Dielectric Strength

12kV/mm

Physical Form

Viscous Liquid

Volume Resistivity

1014Ω cm


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