photo of Epoxy Resin Potting Compound Black, Circuit Boards, PCB's Pot Compound, Flame Retardant Electronics

Epoxy Resin Potting Compound Black, Circuit Boards, PCB's Pot Resin, Flame Retar

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Epoxy Resin Potting Compound Black, Circuit Boards, PCB's Pot Resin, Flame Retardant Electronics

A high quality good all round easy to apply two-part flame retardant black epoxy resin potting compound designed for general purpose electronics use. This epoxy potting compound provides a hard coating around your electrical components and offers excellent all-round protection including resistance to chemicals and water. Using a ’clean' type of flame retardant technology this epoxy compound, when heated, produces low toxicity fumes and low smoke emission. The components that go to make up this black epoxy resin potting compound are supplied in convenient two-component packs, one containing the epoxy resin and the other containing the hardener. The contents are mixed together without opening the bag, simply remove the central clip and mix!

What is Epoxy Resin Potting Compound?

This epoxy resin is a type of electronic potting compound used for encasing or encapsulating PCBs (Printed Circuit Boards) and electronics components. Potting is a process of filling a complete electronic assembly with a solid or gelatinous compound. The potting compound, once applied, cured and hardened encases your electronics in a solid mass providing a barrier which protects and insulates them from harsh environments. These harsh environments include moisture, chemicals, vibration, thermal or physical shock and general contamination. The mechanical protection provided by this epoxy compound enables the components to maintain high performance under extreme conditions.

Features and Benefits

• High hardness material
• Excellent mechanical protection against vibration and physical shock
• Good chemical resistance and water resistance
• Excellent electrical insulation properties
• Adheres to a wide range of substrates
• Flame retardant to UL94 V-0 with 'clean' flame retardant technology
• Hardener free of DDMs or other aromatic amines
• Low shrinkage ratio during curing
• Low coefficient of thermal expansion when subject to temperature changes
• ’Mix in the bag’ twin pack design reduces user contact and mess

What is This Epoxy Resin Potting Compound Used For?

This black epoxy resin is designed to provide protection to electrical components in a general use environment in standard atmospheric conditions. The applications for this cost-effective and versatile compound are diverse and can include PCBs and electronic components in military, industrial, automotive and domestic devices.

Whats in the Pack?

This black epoxy potting compound is supplied in twin pack format. One pack contains the epoxy resin and one contains the hardener both measured to the correct mix ratio. The two compartments are separated by a clip, which, when removed, forms one bag allowing you to mix the contents together. This design prevents air entrapment and allows the epoxy to be applied without any direct user contact avoiding excessive handling and mess. Each twin pack is supplied with full instructions for use. All packs are supplied with a desiccant for storage.

How do you Apply Potting Compound?

Before applying this epoxy potting compound it is important that any residue or contaminants are removed from the electronic components prior to potting. The electronic assembly is placed inside a mould called ’The pot’. This mould is then filled with the mixed potting compound that hardens and permanently protects the assembly. Circuit boards can also be potted and are often called ’potted’ PCBs. These circuit boards have high walled sides forming an enclosure with the mounted electronic components sitting inside. The potting compound is then poured into this enclosure.

Potting Compounds: Twin Packs

Specifications

Attribute

Value

Product Material

Epoxy

Package Type

Pack

Package Size

50 g

Special Properties

Flame Retardant

Cure Time

24 h

Hardness

85 Shore D

Thermal Conductivity

0.45W/mK

Colour

Black

Maximum Operating Temperature

+120°C

Minimum Operating Temperature

-40°C

Physical Form

Viscous Liquid

Viscosity Measurement

000 mPa/s at +25°C, 150

Odour

Characteristic

Operating Temperature Range

-40 → +120 °C

Dielectric Strength

16.6kV/mm

Chemical Composition

Epoxy Resin, Formaldehyde, Neodecanoic Acid Glycidyl Ester, Polymer with 1, 3 Dimethylbenzene


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