photo of Potting, Encapsulating Adhesive Sticks Black, Hot-melt Pot Compound Tecbond 7718/12/250

Potting, Encapsulating Adhesive Sticks Black, Hot-melt Pot Compound Tecbond 7718

  • £22.99
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Product Details

Potting, Encapsulating Adhesive Sticks Black, Hot-melt Pot Compound Tecbond 7718/12/250

Potting and encapsulating adhesive for use in electronics. It can replace traditional potting compounds, such as epoxy or polyurethane, which require mixing and contain hazardous chemicals.Providing it is stored and sealed in its foil pouch its shelf life can be 12 months or more.

Very low viscosity with very fast setting time
No mixing, no waste
No flushing or cleaning of equipment between use
Will work in most high performance 12mm glue guns
Heat resistance of 135°C and a softening point of 160°C
Solid black colour thereby hiding all components
Complies with UL 94V0 fire retardency requirements
Very cost effective

Supplied in packs of 10 sticks

Specifications

Attribute

Value

Product Material

Polyamide

Package Type

Stick

Colour

Black

Maximum Operating Temperature

+135°C

Minimum Operating Temperature

-10°C

Operating Temperature Range

-10 → +135 °C

Setting Time

<2min

 


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